Hirotaka Ogawa

Follow

Person

Owariasahi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,153,549
- Issue date Oct 6, 2015
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for exposure of photo-curing resin applied to printed cir...
- Patent number 6,583,849
- Issue date Jun 24, 2003
- Noda Screen Co., Ltd.
- Masanori Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,276,599
- Issue date Aug 21, 2001
- Noda Screen Co., Ltd.
- Hirotaka Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of exposure of photo-curing resin applied to printed circuit...
- Patent number 6,165,544
- Issue date Dec 26, 2000
- Noda Screen Co., Ltd.
- Masanori Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140070368
- Publication date Mar 13, 2014
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS