Hirotaka Okamoto

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component, method of sealing electronic component with r...
- Patent number 6,438,826
- Issue date Aug 27, 2002
- Towa Corporation
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resin sealing a gap between a semiconductor chip and a su...
- Patent number 6,436,331
- Issue date Aug 20, 2002
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Electronic component, method of sealing electronic component with r...
- Publication number 20010013424
- Publication date Aug 16, 2001
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS