Hirotaka Okonogi

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a printed wiring board having a shield layer
- Patent number 5,308,644
- Issue date May 3, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having shielding layer
- Patent number 5,294,755
- Issue date Mar 15, 1994
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packing filler into through-holes in a printed circuit board
- Patent number 5,268,194
- Issue date Dec 7, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 5,268,535
- Issue date Dec 7, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having through-holes covered with ink layer an...
- Patent number 5,266,748
- Issue date Nov 30, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board shielded from electromagnetic wave
- Patent number 5,262,596
- Issue date Nov 16, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit boards
- Patent number 5,240,737
- Issue date Aug 31, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electromagnetic wave shield printed wir...
- Patent number 5,236,736
- Issue date Aug 17, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an insulating layer on a printed circuit board
- Patent number 5,234,745
- Issue date Aug 10, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 5,219,607
- Issue date Jun 15, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having shielding layer
- Patent number 5,220,135
- Issue date Jun 15, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a printed circuit board
- Patent number 5,210,940
- Issue date May 18, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with electromagnetic wave shielding layer
- Patent number 5,210,379
- Issue date May 11, 1993
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,195,238
- Issue date Mar 23, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting an electromagnetic wave shielding layer with...
- Patent number 5,196,230
- Issue date Mar 23, 1993
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming through-holes in printed wiring board
- Patent number 5,191,709
- Issue date Mar 9, 1993
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for packing filler into through-holes or the like in a pr...
- Patent number 5,145,691
- Issue date Sep 8, 1992
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of filling conductive material into through holes of printed...
- Patent number 5,133,120
- Issue date Jul 28, 1992
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,112,648
- Issue date May 12, 1992
- Nippon CMK Corp.
- Hirotaka Okonogi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 5,100,695
- Issue date Mar 31, 1992
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with an electronic wave shielding layer
- Patent number 5,030,800
- Issue date Jul 9, 1991
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with filled throughholes
- Patent number 5,028,743
- Issue date Jul 2, 1991
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having conductors interconnected by foamed el...
- Patent number 4,991,060
- Issue date Feb 5, 1991
- Nippon CMK Corporation
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 4,929,491
- Issue date May 29, 1990
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 4,900,602
- Issue date Feb 13, 1990
- Nippon CMK Corp.
- Shin Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 4,885,431
- Issue date Dec 5, 1989
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 4,859,805
- Issue date Aug 22, 1989
- Nippon CMK Corp.
- Shin Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 4,806,706
- Issue date Feb 21, 1989
- Nippon CMK Corp.
- Hideo Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hirotaka Okonogi

Person

Patents Grantslast 30 patents

Method for manufacturing a printed wiring board having a shield layer

Printed wiring board having shielding layer

Method of packing filler into through-holes in a printed circuit board

Printed wiring board

Printed wiring board having through-holes covered with ink layer an...

Printed wiring board shielded from electromagnetic wave

Method of manufacturing printed circuit boards

Method for manufacturing an electromagnetic wave shield printed wir...

Method of forming an insulating layer on a printed circuit board

Method of manufacturing printed circuit board

Printed wiring board having shielding layer

Method of producing a printed circuit board

Printed wiring board with electromagnetic wave shielding layer

Method of manufacturing a printed circuit board

Method for connecting an electromagnetic wave shielding layer with...

Method of forming through-holes in printed wiring board

Apparatus for packing filler into through-holes or the like in a pr...

Method of filling conductive material into through holes of printed...

Method of manufacturing a printed circuit board

Method of manufacturing a printed circuit board

Printed wiring board with an electronic wave shielding layer

Printed circuit board with filled throughholes

Printed circuit board having conductors interconnected by foamed el...

Printed wiring board

Printed wiring board

Printed circuit board

Printed wiring board

Printed wiring board