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Hiroto Urabayashi

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  • Musashimurayama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    XY table for a semiconductor manufacturing apparatus
    • Patent number 6,727,666
    • Issue date Apr 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,024,271
    • Issue date Feb 15, 2000
    • Kabushiki Kaisha Shinkawa
    • Minoru Torihata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents