Hirotoshi Ikeya

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Yokosuka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrolytic solution for electrolytic capacitor and electrolytic c...
- Patent number 5,629,829
- Issue date May 13, 1997
- Kabushiki Kaisha Toshiba
- Hirotoshi Ikeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition, and resin-sealed semiconductor device in w...
- Patent number 4,719,502
- Issue date Jan 12, 1988
- Kabushiki Kaisha Toshiba
- Hirotoshi Ikeya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin encapsulation type semiconductor device by use of epoxy resin...
- Patent number 4,710,796
- Issue date Dec 1, 1987
- Kabushiki Kaisha Toshiba
- Hirotoshi Ikeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulation type semiconductor device
- Patent number 4,617,584
- Issue date Oct 14, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hirotoshi Ikeya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin encapsulation type semiconductor device
- Patent number 4,572,853
- Issue date Feb 25, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hirotoshi Ikeya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 4,248,920
- Issue date Feb 3, 1981
- Tokyo Shibaura Denki Kabushiki Kaisha
- Akira Yoshizumi
- H01 - BASIC ELECTRIC ELEMENTS