Hirotoshi Maeda

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive polymide precursor resin composition
- Patent number 6,664,021
- Issue date Dec 16, 2003
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide precursor composition with photoacid gener...
- Patent number 5,449,588
- Issue date Sep 12, 1995
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicon-containing polyamic acid derivative and photosensitive resi...
- Patent number 5,449,705
- Issue date Sep 12, 1995
- Chisso Corporation
- Eiji Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide precursor composition
- Patent number 5,442,024
- Issue date Aug 15, 1995
- Chisso Corporation
- Kouichi Kunimune
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of preparing a negative pattern utilizing photosensitive pol...
- Patent number 5,342,739
- Issue date Aug 30, 1994
- Chisso Corporation
- Kouichi Katou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polyimide photosensitive cover coating agent
- Patent number 5,326,792
- Issue date Jul 5, 1994
- Chisso Corporation
- Yoshinori Masaki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming a pattern from a photosensitive heat-resistant po...
- Patent number 5,320,935
- Issue date Jun 14, 1994
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive heat-resistant polymer having hydroxyphenyl group fo...
- Patent number 5,298,359
- Issue date Mar 29, 1994
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing polyisoimide
- Patent number 5,294,696
- Issue date Mar 15, 1994
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for preparing photosensitive heat-resistant polymer
- Patent number 5,055,549
- Issue date Oct 8, 1991
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polymer having thiol group
- Patent number 5,026,788
- Issue date Jun 25, 1991
- Chisso Corporation
- Hirotoshi Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive poly(amide)imide heat-resistant polymer
- Patent number 5,025,088
- Issue date Jun 18, 1991
- Chisso Corporation
- Hirotoshi Maeda
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Low-melting polyimide copolymer and method for preparing the same
- Patent number 4,904,758
- Issue date Feb 27, 1990
- Chisso Corporation
- Kouichi Kunimune
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hirotoshi Maeda

Person

Patents Grantslast 30 patents

Photosensitive polymide precursor resin composition

Photosensitive polyimide precursor composition with photoacid gener...

Silicon-containing polyamic acid derivative and photosensitive resi...

Photosensitive polyimide precursor composition

Method of preparing a negative pattern utilizing photosensitive pol...

Polyimide photosensitive cover coating agent

Method of forming a pattern from a photosensitive heat-resistant po...

Photosensitive heat-resistant polymer having hydroxyphenyl group fo...

Process for producing polyisoimide

Process for preparing photosensitive heat-resistant polymer

Photosensitive polymer having thiol group

Photosensitive poly(amide)imide heat-resistant polymer

Low-melting polyimide copolymer and method for preparing the same