Hirotsugu Funato

Follow

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing method for semiconductor substrate
- Patent number 7,901,967
- Issue date Mar 8, 2011
- Denso Corporation
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dynamic quantity sensor having movable and fixed electrodes with hi...
- Patent number 6,508,126
- Issue date Jan 21, 2003
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Cap attachment structure, semiconductor sensor device and method
- Publication number 20070232107
- Publication date Oct 4, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and dicing method for semiconductor substrate
- Publication number 20070111478
- Publication date May 17, 2007
- DENSO CORPORATION
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer product and processing method therefor
- Publication number 20070111480
- Publication date May 17, 2007
- DENSO CORPORATION
- Yumi Maruyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical Hall device and method for adjusting offset voltage of ver...
- Publication number 20060097715
- Publication date May 11, 2006
- DENSO CORPORATION
- Satoshi Oohira
- G01 - MEASURING TESTING
Information Patent Application
Dynamic quantity sensor having movable and fixed electrodes with hi...
- Publication number 20020011107
- Publication date Jan 31, 2002
- Minekazu Sakai
- G01 - MEASURING TESTING