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Hiroumi Ueno

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  • Ota-Ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Splitting method for optical device wafer
    • Patent number 8,946,056
    • Issue date Feb 3, 2015
    • Disco Corporation
    • Hiroumi Ueno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Sapphire wafer dividing method
    • Patent number 8,518,730
    • Issue date Aug 27, 2013
    • Disco Corporation
    • Hitoshi Hoshino
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SPLITTING METHOD FOR OPTICAL DEVICE WAFER
    • Publication number 20120289026
    • Publication date Nov 15, 2012
    • Disco Corporation
    • Hiroumi Ueno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SAPPHIRE WAFER DIVIDING METHOD
    • Publication number 20120083059
    • Publication date Apr 5, 2012
    • Disco Corporation
    • Hitoshi Hoshino
    • H01 - BASIC ELECTRIC ELEMENTS