Hiroya YUZAWA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus
- Patent number 11,367,703
- Issue date Jun 21, 2022
- Shinkawa Ltd.
- Hiroya Yuzawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 10,118,246
- Issue date Nov 6, 2018
- SHINIKAWA LTD.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS
- Publication number 20210202432
- Publication date Jul 1, 2021
- SHINKAWA LTD.
- Hiroya YUZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS
- Publication number 20170291251
- Publication date Oct 12, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND METHOD OF ESTIMATING POSITION OF LANDING POIN...
- Publication number 20170154864
- Publication date Jun 1, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR