Hiroyasu Iwama

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Anjo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method and bonding structure of thermoplastic resin material
- Patent number 6,605,357
- Issue date Aug 12, 2003
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting printed circuit boards and interconnecti...
- Patent number 6,449,836
- Issue date Sep 17, 2002
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR