Hiroyoshi Yokoyama

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Yuki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 5,826,330
- Issue date Oct 27, 1998
- Hitachi Aic Inc.
- Satoshi Isoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring boards
- Patent number 5,153,987
- Issue date Oct 13, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for printed wiring boards with acrylonitrile-b...
- Patent number 5,053,280
- Issue date Oct 1, 1991
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing printed circuit board
- Patent number 4,585,502
- Issue date Apr 29, 1986
- Hitachi Condenser Co., Ltd.
- Nobuo Uozu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR