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Hiroyuki DEAI
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Saitama, JP
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last 30 patents
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Patent Grant
Bonding wire for semiconductor device
Patent number
10,950,570
Issue date
Mar 16, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing silicon carbide single crystal
Patent number
10,526,722
Issue date
Jan 7, 2020
Showa Denko K.K.
Masashi Nakabayashi
C30 - CRYSTAL GROWTH
Information
Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
Patent number
10,381,320
Issue date
Aug 13, 2019
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SILICA SPHERICAL PARTICLES FOR SEMICONDUCTOR SEALING MATERIAL
Publication number
20220009783
Publication date
Jan 13, 2022
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Katsumasa YAGI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Application
METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL
Publication number
20180251909
Publication date
Sep 6, 2018
NIPPON STEEL & SUMITOMO METAL CORPORATION
Masashi NAKABAYASHI
C30 - CRYSTAL GROWTH
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20170110430
Publication date
Apr 20, 2017
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Tetsuya OYAMADA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20170040281
Publication date
Feb 9, 2017
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Tetsuya OYAMADA
B32 - LAYERED PRODUCTS