Hiroyuki DEAI

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing silicon carbide single crystal
- Patent number 10,526,722
- Issue date Jan 7, 2020
- Showa Denko K.K.
- Masashi Nakabayashi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICA SPHERICAL PARTICLES FOR SEMICONDUCTOR SEALING MATERIAL
- Publication number 20220009783
- Publication date Jan 13, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Katsumasa YAGI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL
- Publication number 20180251909
- Publication date Sep 6, 2018
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Masashi NAKABAYASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170110430
- Publication date Apr 20, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170040281
- Publication date Feb 9, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B32 - LAYERED PRODUCTS