Hiroyuki Fukasawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical element package and method of manufacturing the same
- Patent number 8,962,355
- Issue date Feb 24, 2015
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method of manufacturing the same
- Patent number 8,654,810
- Issue date Feb 18, 2014
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device having a thermal conductive member with wirin...
- Patent number 8,619,825
- Issue date Dec 31, 2013
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical element package and method of manufacturing the same
- Patent number 8,158,997
- Issue date Apr 17, 2012
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module, light source apparatus and liquid crystal display
- Patent number 7,878,680
- Issue date Feb 1, 2011
- Sony Corporation
- Toyomi Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source apparatus and display apparatus and white resist layer
- Patent number 7,728,343
- Issue date Jun 1, 2010
- Sony Corporation
- Toyomi Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module having external elect...
- Patent number 6,992,395
- Issue date Jan 31, 2006
- Sony Corporation
- Hiroyuki Fukasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and electronic device using same
- Patent number 5,973,931
- Issue date Oct 26, 1999
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux for soldering using solder preforms
- Patent number 5,932,030
- Issue date Aug 3, 1999
- Sony Corporation
- Hiroyuki Fukasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin molding apparatus
- Patent number 5,882,692
- Issue date Mar 16, 1999
- Sony Corporation
- Akira Kojima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wiring board and electronic device using same
- Patent number 5,844,782
- Issue date Dec 1, 1998
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding apparatus
- Patent number 5,650,177
- Issue date Jul 22, 1997
- Sony Corporation
- Akira Kojima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaging of semiconductor chips with resin
- Patent number 5,289,033
- Issue date Feb 22, 1994
- Sony Corporation
- Yukio Asami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 5,268,532
- Issue date Dec 7, 1993
- Sony Corporation
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of semiconductor chips
- Patent number 5,214,846
- Issue date Jun 1, 1993
- Sony Corporation
- Yukio Asami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175793
- Publication date Jul 12, 2012
- SONY CORPORATION
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100213471
- Publication date Aug 26, 2010
- SONY CORPORATION
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100215073
- Publication date Aug 26, 2010
- SONY CORPORATION
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100193821
- Publication date Aug 5, 2010
- SONY CORPORATION
- Hiroyuki Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE APPARATUS, AND DISPLAY APPARATUS
- Publication number 20090141492
- Publication date Jun 4, 2009
- SONY CORPORATION
- Toyomi Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE MODULE, LIGHT SOURCE APPARATUS AND LIQUID CRYSTAL DISPLAY
- Publication number 20080143916
- Publication date Jun 19, 2008
- SONY CORPORATION
- Toyomi Fujino
- G02 - OPTICS
Information Patent Application
Semiconductor device and semiconductor module
- Publication number 20030183930
- Publication date Oct 2, 2003
- Hiroyuki Fukasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated electronic device and integration method
- Publication number 20020109216
- Publication date Aug 15, 2002
- Yuko Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Fukasawa

Person

Patents Grantslast 30 patents

Optical element package and method of manufacturing the same

Light-emitting device and method of manufacturing the same

Light-emitting device having a thermal conductive member with wirin...

Optical element package and method of manufacturing the same

Light source module, light source apparatus and liquid crystal display

Light source apparatus and display apparatus and white resist layer

Semiconductor device and semiconductor module having external elect...

Printed wiring board and electronic device using same

Flux for soldering using solder preforms

Resin molding apparatus

Printed wiring board and electronic device using same

Resin molding apparatus

Packaging of semiconductor chips with resin

Semiconductor device

Packaging of semiconductor chips

Patents Applicationslast 30 patents

OPTICAL ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT SOURCE APPARATUS, AND DISPLAY APPARATUS

LIGHT SOURCE MODULE, LIGHT SOURCE APPARATUS AND LIQUID CRYSTAL DISPLAY

Semiconductor device and semiconductor module

Integrated electronic device and integration method