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Hiroyuki Ishitomi
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Takatsuki-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of producing circuit component built-in module with embedded...
Patent number
7,140,104
Issue date
Nov 28, 2006
Matsushita Electric Industrial Co., Ltd.
Koichi Hirano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Transfer sheet and wiring board using the same, and method of manuf...
Patent number
7,001,662
Issue date
Feb 21, 2006
Matsushita Electric Industrial Co., Ltd.
Yasuhiro Sugaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit component, circuit component package, circuit component bui...
Patent number
6,787,884
Issue date
Sep 7, 2004
Matsushita Electric Industrial Co., Ltd.
Koichi Hirano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Transfer sheet and wiring board using the same, and method of manuf...
Publication number
20060078669
Publication date
Apr 13, 2006
Matsushita Electric Industrial Co., Ltd.
Yasuhiro Sugaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit component, circuit component package, circuit component bui...
Publication number
20050005420
Publication date
Jan 13, 2005
Matsushita Electric Industrial Co., Ltd.
Koichi Hirano
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Transfer sheet and wiring board using the same, and method of manuf...
Publication number
20040191491
Publication date
Sep 30, 2004
Matsushita Electric Industrial Co., Ltd.
Yasuhiro Sugaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit component, circuit component package,, circuit component bu...
Publication number
20030222335
Publication date
Dec 4, 2003
Matsushita Electric Industrial Co., Ltd.
Koichi Hirano
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...