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Hiroyuki IWAMOTO
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,495,566
Issue date
Nov 8, 2022
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Switch with OAM functions
Patent number
8,537,686
Issue date
Sep 17, 2013
Juniper Networks, Inc.
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
ATM switch with OAM functions
Patent number
7,864,685
Issue date
Jan 4, 2011
Juniper Networks, Inc.
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
ATM switch with OAM functions
Patent number
6,865,158
Issue date
Mar 8, 2005
NEC Corporation
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
ATM cell buffer system and its congestion control method
Patent number
6,804,198
Issue date
Oct 12, 2004
NEC Corporation
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
ATM cell buffer read control system and control method
Patent number
6,738,385
Issue date
May 18, 2004
NEC Corporation
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Temperature-compensated piezoelectric oscillator
Patent number
5,572,169
Issue date
Nov 5, 1996
NEC Corporation
Hiroyuki Iwamoto
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
FLUX-COATED BALL AND METHOD FOR MANUFACTURING SAME
Publication number
20230249293
Publication date
Aug 10, 2023
SENJU METAL INDUSTRY CO., LTD.
Ayaka SHIRAKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Metal Body, Fitting Connection Terminal, and Method for Forming Met...
Publication number
20230094946
Publication date
Mar 30, 2023
SENJU METAL INDUSTRY CO., LTD.
Hiroyuki Iwamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20220077093
Publication date
Mar 10, 2022
SENJU METAL INDUSTRY CO., LTD.
Shigeki KONDOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT
Publication number
20170348805
Publication date
Dec 7, 2017
SENJU METAL INDUSTRY CO., LTD.
Kaichi TSURUTA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
ATM SWITCH WITH OAM FUNCTIONS
Publication number
20110134921
Publication date
Jun 9, 2011
Juniper Networks, Inc.
Hiroyuki IWAMOTO
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ATM switch with OAM functions
Publication number
20050185652
Publication date
Aug 25, 2005
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ATM switch with OAM functions
Publication number
20010002909
Publication date
Jun 7, 2001
Hiroyuki Iwamoto
H04 - ELECTRIC COMMUNICATION TECHNIQUE