Hiroyuki Kimura

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Kumamoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame, semiconductor device produced by using the same and met...
- Patent number 7,291,905
- Issue date Nov 6, 2007
- NEC Electronics Corporation
- Koki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in which a semiconductor chip mounted on a pri...
- Patent number 6,972,488
- Issue date Dec 6, 2005
- NEC Compound Semiconductor Devices, Ltd.
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030127732
- Publication date Jul 10, 2003
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030127733
- Publication date Jul 10, 2003
- Taibo Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin-sealed type semiconductor device
- Publication number 20030030154
- Publication date Feb 13, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Taibo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, semiconductor device produced by using the same and me...
- Publication number 20020020906
- Publication date Feb 21, 2002
- NEC Corporation
- Koki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS