Hiroyuki Kiyomura

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and apparatus
- Patent number 6,712,111
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare chip mounting method and bare chip mounting system
- Patent number 6,680,221
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding unit with tray storage and transport apparatuses
- Patent number 6,647,616
- Issue date Nov 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Nobuya Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,474,538
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component feeder with load position alignment recognition
- Patent number 6,467,158
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki Kiyomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC discarding apparatus for flip chip mounting facility
- Patent number 6,129,203
- Issue date Oct 10, 2000
- Matsushita Electric Industrial Co., Ltd.
- Hiroyuki Kiyomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bare chip mounting method and bare chip mounting system
- Publication number 20030096451
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20020125303
- Publication date Sep 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Kiyomura

Person

Patents Grantslast 30 patents

Bump bonding method apparatus

Bonding method and apparatus

Bare chip mounting method and bare chip mounting system

Bump bonding unit with tray storage and transport apparatuses

Bonding apparatus and bonding method

Component feeder with load position alignment recognition

IC discarding apparatus for flip chip mounting facility

Patents Applicationslast 30 patents

Bump bonding method and apparatue

Bare chip mounting method and bare chip mounting system

Bonding method and apparatus