Hiroyuki Kohno

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Tokuyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Abrasive and method for polishing semiconductor substrate
- Patent number 6,354,913
- Issue date Mar 12, 2002
- Kabushiki Kaisha Toshiba
- Naoto Miyashita
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive material for polishing a semiconductor wafer, and methods...
- Patent number 6,045,605
- Issue date Apr 4, 2000
- Kabushiki Kaisha Toshiba
- Kenji Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing slurries and a process for the production thereof
- Patent number 5,904,159
- Issue date May 18, 1999
- Tokuyama Corporation
- Hiroshi Kato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...