Hiroyuki Kondo

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 8,975,759
- Issue date Mar 10, 2015
- Nitto Denko Corporation
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 8,278,153
- Issue date Oct 2, 2012
- Nitto Denko Corporation
- Sadahito Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
- Patent number 7,772,040
- Issue date Aug 10, 2010
- Nitto Denko Corporation
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE-SENSITIVE ADHESIVE FILM
- Publication number 20200248037
- Publication date Aug 6, 2020
- NITTO DENKO CORPORATION
- Hakaru HORIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD...
- Publication number 20130237017
- Publication date Sep 12, 2013
- Nitto Denko Corporation
- Hiroyuki KONDO
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20130020724
- Publication date Jan 24, 2013
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF...
- Publication number 20110111563
- Publication date May 12, 2011
- Nitto Denko Corporation
- Yuichiro YANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20100264531
- Publication date Oct 21, 2010
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20100197080
- Publication date Aug 5, 2010
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100119759
- Publication date May 13, 2010
- Nitto Denko Corporation
- Hiroyuki Kondo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-PEELABE PRESSURE-SENSITIVE ADHESIVE SHEET CONTAINING LAYERED S...
- Publication number 20100119816
- Publication date May 13, 2010
- Nitto Denko Corporation
- Daisuke Shimokawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20090001611
- Publication date Jan 1, 2009
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
- Publication number 20080064141
- Publication date Mar 13, 2008
- Sadahito Misumi
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Kondo

Person

Patents Grantslast 30 patents

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Manufacturing method of semiconductor device, adhesive sheet used t...

Manufacturing method of semiconductor device, adhesive sheet used t...

Manufacturing method of semiconductor device, adhesive sheet used t...

Patents Applicationslast 30 patents

PRESSURE-SENSITIVE ADHESIVE FILM

PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...

ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

ADHESIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE

HEAT-PEELABE PRESSURE-SENSITIVE ADHESIVE SHEET CONTAINING LAYERED S...

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...