Hiroyuki MATSUI

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reflow apparatus, a reflow method, and a manufacturing method of a...
- Patent number 8,490,857
- Issue date Jul 23, 2013
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow apparatus, a reflow method, and a manufacturing method of se...
- Patent number 8,336,756
- Issue date Dec 25, 2012
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device and apparatus therefor
- Patent number 8,302,843
- Issue date Nov 6, 2012
- Fujitsu Semiconductor Limited
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of electrode and manufacturing method of semiconduct...
- Patent number 7,888,258
- Issue date Feb 15, 2011
- Fujitsu Semiconductor Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder jointing system, solder jointing method, semiconductor devic...
- Patent number 6,732,911
- Issue date May 11, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method, electronic parts mountin...
- Patent number 6,666,369
- Issue date Dec 23, 2003
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing solder bumps and solder joints using formic...
- Patent number 6,344,407
- Issue date Feb 5, 2002
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
- Publication number 20120251968
- Publication date Oct 4, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A...
- Publication number 20120187181
- Publication date Jul 26, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
- Publication number 20090184156
- Publication date Jul 23, 2009
- Fujitsu Microelectronics Limited
- Hiroyuki MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF ELECTRODE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20090087984
- Publication date Apr 2, 2009
- Fujitsu Microelectronics Limited
- Yoshito AKUTAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow apparatus, a reflow method, and a manufacturing method of se...
- Publication number 20070099411
- Publication date May 3, 2007
- FUJITSU LIMITED
- Hiroyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder jointing system, solder jointing method, semiconductor devic...
- Publication number 20020130164
- Publication date Sep 19, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method, electronic parts mountin...
- Publication number 20020076909
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki MATSUI

Person

Patents Grantslast 30 patents

Reflow apparatus, a reflow method, and a manufacturing method of a...

Reflow apparatus, a reflow method, and a manufacturing method of se...

Process for producing semiconductor device and apparatus therefor

Forming method of electrode and manufacturing method of semiconduct...

Solder jointing system, solder jointing method, semiconductor devic...

Semiconductor device manufacturing method, electronic parts mountin...

Method of manufacturing solder bumps and solder joints using formic...

Patents Applicationslast 30 patents

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A...

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

FORMING METHOD OF ELECTRODE AND MANUFACTURING METHOD OF SEMICONDUCT...

Reflow apparatus, a reflow method, and a manufacturing method of se...

Solder jointing system, solder jointing method, semiconductor devic...

Semiconductor device manufacturing method, electronic parts mountin...