Hiroyuki Matsuo

Person

Tino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejecting apparatus and method of controlling liquid ejecting...
- Patent number 8,449,057
- Issue date May 28, 2013
- Seiko Epson Corporation
- Hiroyuki Matsuo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting apparatus and method of controlling liquid ejecting...
- Patent number 8,434,842
- Issue date May 7, 2013
- Seiko Epson Corporation
- Hiroyuki Matsuo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting apparatus
- Patent number 8,313,160
- Issue date Nov 20, 2012
- Seiko Epson Corporation
- Hiroyuki Matsuo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor substrate treating method, semiconductor component an...
- Patent number 7,875,557
- Issue date Jan 25, 2011
- Seiko Epson Corporation
- Hiroyuki Matsuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device and flexible printed wiring board
- Patent number 7,837,497
- Issue date Nov 23, 2010
- Kabushiki Kaisha Toshiba
- Hiroyuki Matsuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device, and a semiconductor...
- Patent number 7,439,183
- Issue date Oct 21, 2008
- Kabushiki Kaisha Toshiba
- Kunihiro Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, a method of forming a trench isolation structure, a...
- Patent number 7,365,012
- Issue date Apr 29, 2008
- Seiko Epson Corporation
- Hiroyuki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EJECTING APPARATUS AND CONTROL METHOD THEREOF
- Publication number 20120256981
- Publication date Oct 11, 2012
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS AND CONTROLLING METHOD THEREOF
- Publication number 20120081430
- Publication date Apr 5, 2012
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS
- Publication number 20110134176
- Publication date Jun 9, 2011
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...
- Publication number 20110096112
- Publication date Apr 28, 2011
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...
- Publication number 20110096111
- Publication date Apr 28, 2011
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS AND CONTROL METHOD OF LIQUID EJECTING APP...
- Publication number 20110090274
- Publication date Apr 21, 2011
- SEIKO EPSON CORPORATION
- Nobutoshi Otsuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...
- Publication number 20110090272
- Publication date Apr 21, 2011
- SEIKO EPSON CORPORATION
- Hiroyuki MATSUO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICE AND FLEXIBLE PRINTED WIRING BOARD
- Publication number 20100304614
- Publication date Dec 2, 2010
- Kabushiki Kaisha Toshiba
- Hiroyuki MATSUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer cleaning method and equipment
- Publication number 20080202559
- Publication date Aug 28, 2008
- Kabushiki Kaisha Toshiba Dainippon Screen Mfg.Co., Ltd.
- Kunihiro Miyazaki
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor substrate treating method, semiconductor component an...
- Publication number 20060144421
- Publication date Jul 6, 2006
- Hiroyuki Matsuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manufacturing a semiconductor device, and a semiconductor...
- Publication number 20060046487
- Publication date Mar 2, 2006
- Kabushiki Kaisha Toshiba
- Kunihiro Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method, a method of forming a trench isolation structure, a...
- Publication number 20060033178
- Publication date Feb 16, 2006
- Hiroyuki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer cleaning method and equipment
- Publication number 20050081886
- Publication date Apr 21, 2005
- Kunihiro Miyazaki
- G01 - MEASURING TESTING

Hiroyuki Matsuo

Person

Patents Grantslast 30 patents

Liquid ejecting apparatus and method of controlling liquid ejecting...

Liquid ejecting apparatus and method of controlling liquid ejecting...

Liquid ejecting apparatus

Semiconductor substrate treating method, semiconductor component an...

Electronic device and flexible printed wiring board

Method of manufacturing a semiconductor device, and a semiconductor...

Etching method, a method of forming a trench isolation structure, a...

Patents Applicationslast 30 patents

LIQUID EJECTING APPARATUS AND CONTROL METHOD THEREOF

LIQUID EJECTING APPARATUS AND CONTROLLING METHOD THEREOF

LIQUID EJECTING APPARATUS

LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...

LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...

LIQUID EJECTING APPARATUS AND CONTROL METHOD OF LIQUID EJECTING APP...

LIQUID EJECTING APPARATUS AND METHOD OF CONTROLLING LIQUID EJECTING...

ELECTRONIC DEVICE AND FLEXIBLE PRINTED WIRING BOARD

Wafer cleaning method and equipment

Semiconductor substrate treating method, semiconductor component an...

Method of manufacturing a semiconductor device, and a semiconductor...

Etching method, a method of forming a trench isolation structure, a...

Wafer cleaning method and equipment