HIROYUKI MORI

Person

SHIGA-KEN, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal base substrate, electronic component mounting substrate
- Patent number 12,127,342
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,107,097
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tetsuya Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state imaging apparatus and electronic apparatus
- Patent number 11,888,008
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tetsuya Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and manuf...
- Patent number 11,795,525
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side pad anchored by next adjacent via
- Patent number 11,735,529
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy, copper alloy plastic-processed material, component fo...
- Patent number 11,732,329
- Issue date Aug 22, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic/electrical devices, copper alloy planar...
- Patent number 11,725,258
- Issue date Aug 15, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Restoring a wearable biological sensor
- Patent number 11,660,026
- Issue date May 30, 2023
- International Business Machines Corporation
- Keiji Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy sheet/str...
- Patent number 11,655,523
- Issue date May 23, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,652,115
- Issue date May 16, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tetsuya Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an interconnection using a sacrificial layer
- Patent number 11,574,817
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Takahito Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic elastomer for carbon fiber reinforced plastic bonding...
- Patent number 11,572,460
- Issue date Feb 7, 2023
- MCPP Innovation LLC
- Hiroyuki Mori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article sorting facility
- Patent number 11,390,468
- Issue date Jul 19, 2022
- Daifuku Co., Ltd.
- Hiroyuki Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Article sorting facility
- Patent number 11,312,580
- Issue date Apr 26, 2022
- Daifuku Co., Ltd.
- Hiroyuki Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Valve device, processing apparatus, and control method
- Patent number 11,306,847
- Issue date Apr 19, 2022
- Tokyo Electron Limited
- Tomohisa Kimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnection with side connection to substrate
- Patent number 11,264,314
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source material container
- Patent number 11,193,205
- Issue date Dec 7, 2021
- Tokyo Electron Limited
- Yuichi Furuya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solid-state imaging apparatus and electronic apparatus
- Patent number 11,171,167
- Issue date Nov 9, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tetsuya Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection management system, inspection management apparatuses, an...
- Patent number 11,154,001
- Issue date Oct 19, 2021
- Omron Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 11,114,308
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy sheet/str...
- Patent number 11,104,977
- Issue date Aug 31, 2021
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Laminated circuitry cooling for inter-chip bridges
- Patent number 11,101,191
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Door service hole cover
- Patent number 11,097,602
- Issue date Aug 24, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hiroyuki Mori
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VEHICLE CONTROLLER, METHOD, AND COMPUTER PROGRAM FOR VEHICLE CONTROL
- Publication number 20240355209
- Publication date Oct 24, 2024
- Toyota Jidosha Kabushiki Kaisha
- Hiroyuki MORI
- B60 - VEHICLES IN GENERAL
Information Patent Application
INSPECTION MANAGEMENT SYSTEM, INSPECTION MANAGEMENT DEVICE, INSPECT...
- Publication number 20240319703
- Publication date Sep 26, 2024
- Omron Corporation
- Hiroyuki MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
SOLDER VOLUME FOR FLIP-CHIP BONDING
- Publication number 20240282735
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PURE COPPER PLATE
- Publication number 20240124954
- Publication date Apr 18, 2024
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
QUALITY IMPROVEMENT ASSISTING DEVICE AND QUALITY IMPROVEMENT ASSIST...
- Publication number 20240085896
- Publication date Mar 14, 2024
- Omron Corporation
- Hiroyuki MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS
- Publication number 20240088184
- Publication date Mar 14, 2024
- Sony Semiconductor Solutions Corporation
- Tetsuya UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUALITY IMPROVEMENT ASSISTANCE DEVICE
- Publication number 20240061408
- Publication date Feb 22, 2024
- Omron Corporation
- Hiroyuki MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
MANAGEMENT SYSTEM, MANAGEMENT DEVICE, MANAGEMENT METHOD, AND PROGRAM
- Publication number 20240061402
- Publication date Feb 22, 2024
- Omron Corporation
- Hiroyuki MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
MEASUREMENT SYSTEM, INSPECTION SYSTEM, MEASUREMENT DEVICE, MEASUREM...
- Publication number 20240062401
- Publication date Feb 22, 2024
- Omron Corporation
- Takako ONISHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANAGEMENT DEVICE AND MANAGEMENT SYSTEM
- Publication number 20240061405
- Publication date Feb 22, 2024
- Omron Corporation
- Hiroyuki MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
MANAGEMENT SYSTEM, MANAGEMENT DEVICE, MANAGEMENT METHOD, AND PROGRAM
- Publication number 20240027364
- Publication date Jan 25, 2024
- Omron Corporation
- Hiroyuki MORI
- G01 - MEASURING TESTING
Information Patent Application
SPOT WELDING METHOD
- Publication number 20230311233
- Publication date Oct 5, 2023
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Hideaki MATSUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...
- Publication number 20230313341
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MEMBER FOR FASTENING AND METHOD OF MANUFACTURING SAME
- Publication number 20230296125
- Publication date Sep 21, 2023
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Hideaki MATSUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK
- Publication number 20230262882
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230261014
- Publication date Aug 17, 2023
- Sony Semiconductor Solutions Corporation
- Tetsuya UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230250514
- Publication date Aug 10, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20230243018
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENERGY SUPPLY PLAN FORMULATION DEVICE AND ENERGY SUPPLY PLAN FORMUL...
- Publication number 20230246444
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Hiroyuki MORI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...
- Publication number 20230243020
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...
- Publication number 20230243019
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IMAGE QUALITY EVALUATION DEVICE, IMAGE FORMING DEVICE, AND IMAGE QU...
- Publication number 20230230219
- Publication date Jul 20, 2023
- Konica Minolta, Inc.
- Hiroyuki MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL JOINED BODY AND PRODUCTION METHOD THEREFOR
- Publication number 20230139132
- Publication date May 4, 2023
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Hideaki MATSUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC ELASTOMER FOR CARBON FIBER REINFORCED PLASTIC BONDING...
- Publication number 20230118449
- Publication date Apr 20, 2023
- MCPP Innovation LLC
- Hiroyuki MORI
- B32 - LAYERED PRODUCTS
Information Patent Application
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...
- Publication number 20230114969
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BASE SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20230111128
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PURE COPPER PLATE
- Publication number 20230112081
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...
- Publication number 20230090953
- Publication date Mar 23, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FO...
- Publication number 20230002860
- Publication date Jan 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS

HIROYUKI MORI

Person

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Metal base substrate, electronic component mounting substrate

Solid-state imaging device and electronic apparatus

Controlling of height of high-density interconnection structure on...

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Solid-state imaging apparatus and electronic apparatus

Copper alloy plate, copper alloy plate with plating film, and manuf...

Direct bonded heterogeneous integration silicon bridge

Side pad anchored by next adjacent via

Bonding of bridge to multiple semiconductor chips

Copper alloy, copper alloy plastic-processed material, component fo...

Copper alloy for electronic/electrical devices, copper alloy planar...

Restoring a wearable biological sensor

Copper alloy for electronic/electric device, copper alloy sheet/str...

Solid-state imaging device and electronic apparatus

Fabricating an interconnection using a sacrificial layer

Thermoplastic elastomer for carbon fiber reinforced plastic bonding...

Prevention of bridging between solder joints

Article sorting facility

Article sorting facility

Valve device, processing apparatus, and control method

Interconnection with side connection to substrate

Source material container

Solid-state imaging apparatus and electronic apparatus

Inspection management system, inspection management apparatuses, an...

Controlling of height of high-density interconnection structure on...

Copper alloy for electronic/electric device, copper alloy sheet/str...

Laminated circuitry cooling for inter-chip bridges

Door service hole cover

Prevention of bridging between solder joints

Patents Applicationslast 30 patents

VEHICLE CONTROLLER, METHOD, AND COMPUTER PROGRAM FOR VEHICLE CONTROL

INSPECTION MANAGEMENT SYSTEM, INSPECTION MANAGEMENT DEVICE, INSPECT...

SOLDER VOLUME FOR FLIP-CHIP BONDING

PURE COPPER PLATE

QUALITY IMPROVEMENT ASSISTING DEVICE AND QUALITY IMPROVEMENT ASSIST...

SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS

QUALITY IMPROVEMENT ASSISTANCE DEVICE

MANAGEMENT SYSTEM, MANAGEMENT DEVICE, MANAGEMENT METHOD, AND PROGRAM

MEASUREMENT SYSTEM, INSPECTION SYSTEM, MEASUREMENT DEVICE, MEASUREM...

MANAGEMENT DEVICE AND MANAGEMENT SYSTEM

MANAGEMENT SYSTEM, MANAGEMENT DEVICE, MANAGEMENT METHOD, AND PROGRAM

SPOT WELDING METHOD

COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...

MEMBER FOR FASTENING AND METHOD OF MANUFACTURING SAME

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

ENERGY SUPPLY PLAN FORMULATION DEVICE AND ENERGY SUPPLY PLAN FORMUL...

PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...

COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT F...

IMAGE QUALITY EVALUATION DEVICE, IMAGE FORMING DEVICE, AND IMAGE QU...

METAL JOINED BODY AND PRODUCTION METHOD THEREFOR

THERMOPLASTIC ELASTOMER FOR CARBON FIBER REINFORCED PLASTIC BONDING...

PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...

METAL BASE SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE

PURE COPPER PLATE

PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...

COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FO...