Hiroyuki NAGAI

Person

Nirasaki City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of nickel wiring
- Patent number 10,700,006
- Issue date Jun 30, 2020
- Tokyo Electron Limited
- Hiroaki Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing methods to protect ULK materials from damage during e...
- Patent number 10,304,725
- Issue date May 28, 2019
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu wiring forming method and semiconductor device manufacturing method
- Patent number 10,163,699
- Issue date Dec 25, 2018
- Tokyo Electron Limited
- Hiroyuki Nagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of a self-forming barrier layer and a ruthenium metal l...
- Patent number 10,157,784
- Issue date Dec 18, 2018
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing Cu wiring
- Patent number 10,096,548
- Issue date Oct 9, 2018
- Tokyo Electron Limited
- Kenji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method capable of minimizing deviation of an invers...
- Patent number 9,887,099
- Issue date Feb 6, 2018
- Tokyo Electron Limited
- Hiroyuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and storage medium
- Patent number 9,735,046
- Issue date Aug 15, 2017
- Tokyo Electron Limited
- Peng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including a substrate ha...
- Patent number 9,390,972
- Issue date Jul 12, 2016
- Tokyo Electron Limited
- Kenji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper wiring
- Patent number 9,362,166
- Issue date Jun 7, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering method and sputtering apparatus
- Patent number 9,121,094
- Issue date Sep 1, 2015
- Tokyo Electron Limited
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCALORIC EFFECT ELEMENT, HEAT TRANSFER DEVICE, SEMICONDUCTOR...
- Publication number 20230135523
- Publication date May 4, 2023
- TOKYO ELECTRON LIMITED
- Koji AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF NICKEL WIRING
- Publication number 20180090446
- Publication date Mar 29, 2018
- TOKYO ELECTRON LIMITED
- Hiroaki KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS TO PROTECT ULK MATERIALS FROM DAMAGE DURING E...
- Publication number 20180061700
- Publication date Mar 1, 2018
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu WIRING FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180047624
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Hiroyuki Nagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL HARD MASK AND METHOD OF MANUFACTURING SAME
- Publication number 20170287727
- Publication date Oct 5, 2017
- TOKYO ELECTRON LIMITED
- Yuuki KIKUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATION OF A SELF-FORMING BARRIER LAYER AND A RUTHENIUM METAL...
- Publication number 20170236752
- Publication date Aug 17, 2017
- TOKYO ELECTRON LIMITED
- Kai-Hung L. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING METHOD
- Publication number 20170125262
- Publication date May 4, 2017
- TOKYO ELECTRON LIMITED
- Hiroyuki NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM
- Publication number 20170062269
- Publication date Mar 2, 2017
- TOKYO ELECTRON LIMITED
- Peng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MANGANESE-CONTAINING FILM
- Publication number 20160326646
- Publication date Nov 10, 2016
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING Cu WIRING
- Publication number 20160276218
- Publication date Sep 22, 2016
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Semiconductor Device Including A Substrate Ha...
- Publication number 20150270166
- Publication date Sep 24, 2015
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING
- Publication number 20150262872
- Publication date Sep 17, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MANGANESE-CONTAINING FILM
- Publication number 20150110975
- Publication date Apr 23, 2015
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering method and sputtering apparatus
- Publication number 20080230375
- Publication date Sep 25, 2008
- TOKYO ELECTRON LIMITED
- Kaoru Maekawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFA...
- Publication number 20080213998
- Publication date Sep 4, 2008
- TOKYO ELECTRON LIMITED
- Hiroyuki Nagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for reforming laminated films and laminated fi...
- Publication number 20050212179
- Publication date Sep 29, 2005
- TOKYO ELECTRON LIMITED
- Minoru Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030170970
- Publication date Sep 11, 2003
- Kouji Senoo
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki NAGAI

Person

Patents Grantslast 30 patents

Manufacturing method of nickel wiring

Manufacturing methods to protect ULK materials from damage during e...

Cu wiring forming method and semiconductor device manufacturing method

Integration of a self-forming barrier layer and a ruthenium metal l...

Method of manufacturing Cu wiring

Pattern forming method capable of minimizing deviation of an invers...

Semiconductor device manufacturing method and storage medium

Method of fabricating semiconductor device including a substrate ha...

Method of forming copper wiring

Sputtering method and sputtering apparatus

Patents Applicationslast 30 patents

ELECTROCALORIC EFFECT ELEMENT, HEAT TRANSFER DEVICE, SEMICONDUCTOR...

MANUFACTURING METHOD OF NICKEL WIRING

MANUFACTURING METHODS TO PROTECT ULK MATERIALS FROM DAMAGE DURING E...

Cu WIRING FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METAL HARD MASK AND METHOD OF MANUFACTURING SAME

INTEGRATION OF A SELF-FORMING BARRIER LAYER AND A RUTHENIUM METAL...

PATTERN FORMING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM

METHOD FOR FORMING MANGANESE-CONTAINING FILM

METHOD OF MANUFACTURING Cu WIRING

Method of Fabricating Semiconductor Device Including A Substrate Ha...

METHOD OF FORMING COPPER WIRING

METHOD FOR FORMING MANGANESE-CONTAINING FILM

Sputtering method and sputtering apparatus

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFA...

Method and apparatus for reforming laminated films and laminated fi...

Semiconductor device and method of manufacturing the same