Hiroyuki Nishikawa

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Shiga, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for mounting semiconductor components
- Patent number 7,271,476
- Issue date Sep 18, 2007
- Kyocera Corporation
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring Board and Semiconductor Device
- Publication number 20070285907
- Publication date Dec 13, 2007
- Kyocera Corporation
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor device
- Publication number 20050087850
- Publication date Apr 28, 2005
- KYOCERA CORPORATION
- Hiroyuki Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR