Hiroyuki Ochiai

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Minato-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Welded bellows for semiconductor manufacturing device
- Patent number 9,147,571
- Issue date Sep 29, 2015
- Eagle Industry Co., Ltd.
- Hidekazu Takahashi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor fabrication device welded bellows
- Patent number 8,727,355
- Issue date May 20, 2014
- Eagle Industry Co., Ltd.
- Hidekazu Takahashi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
WELDED BELLOWS FOR SEMICONDUCTOR MANUFACTURING DEVICE
- Publication number 20140082906
- Publication date Mar 27, 2014
- EAGLEBURGMANN JAPAN CO., LTD.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION DEVICE WELDED BELLOWS
- Publication number 20140035236
- Publication date Feb 6, 2014
- EAGLEBURGMANN JAPAN CO., LTD.
- Hidekazu Takahashi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...