Hiroyuki Okuhira

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for fiber reinforced composite material
- Patent number 8,668,983
- Issue date Mar 11, 2014
- The Yokohama Rubber Co., Ltd.
- Masayuki Kawazoe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition
- Patent number 7,223,821
- Issue date May 29, 2007
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curing component and curable resin composition containing the curin...
- Patent number 7,189,770
- Issue date Mar 13, 2007
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compound having thermally dissociatable thioacetal skeleton, precur...
- Patent number 7,105,630
- Issue date Sep 12, 2006
- The Yokohama Rubber Co., Ltd.
- Wonmun Choi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-part, room temperature moisture curable resin composition
- Patent number 6,936,676
- Issue date Aug 30, 2005
- Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of polyepoxide and oxazolidine latent curing agent
- Patent number 6,794,479
- Issue date Sep 21, 2004
- The Yokohama Rubber Co, Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-part, room temperature moisture curable resin composition
- Patent number 6,756,466
- Issue date Jun 29, 2004
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable compounds, curable resin compositions containing the same a...
- Patent number 6,670,445
- Issue date Dec 30, 2003
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition and novel latent curing agent
- Patent number 6,559,269
- Issue date May 6, 2003
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of thiirane and oxirane-containing compound and oxirane-co...
- Patent number 6,528,595
- Issue date Mar 4, 2003
- The Yokohama Rubber Co., Ltd.
- Masahiro Ikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-pack cold moisture curable resin compositions
- Patent number 6,525,159
- Issue date Feb 25, 2003
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-pack composition of epoxy resin(s) with no oh groups and ketimine
- Patent number 6,476,160
- Issue date Nov 5, 2002
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-part moisture curable composition
- Patent number 6,271,333
- Issue date Aug 7, 2001
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
One-pack type moisture-curable composition
- Patent number 6,221,998
- Issue date Apr 24, 2001
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Room temperature curing polyurethane compositions
- Patent number 5,747,627
- Issue date May 5, 1998
- The Yokohama Rubber Co., Ltd.
- Kazushi Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL
- Publication number 20100062211
- Publication date Mar 11, 2010
- Masayuki Kawazoe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED CONJUGATED DIENE-BASED POLYMER RUBBER AND RUBBER COMPOSITI...
- Publication number 20090143525
- Publication date Jun 4, 2009
- The Yokohama Rubber Co., Ltd.
- Makoto Ashiura
- B60 - VEHICLES IN GENERAL
Information Patent Application
Moisture-curable resin composition
- Publication number 20070149727
- Publication date Jun 28, 2007
- The Yokohama Rubber Co., Ltd.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable resin composition
- Publication number 20050171318
- Publication date Aug 4, 2005
- THE YOKOHAMA RUBBER CO., LTD.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable resin composition
- Publication number 20050085596
- Publication date Apr 21, 2005
- THE YOKOHAMA RUBBER CO., LTD.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
One-part, room temperature moisture curable resin composition
- Publication number 20040192873
- Publication date Sep 30, 2004
- THE YOKOHAMA RUBBER CO., LTD.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable resin composition
- Publication number 20040167275
- Publication date Aug 26, 2004
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curing component and curable resin composition containing the curin...
- Publication number 20040116644
- Publication date Jun 17, 2004
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
One-part, room temperature moisture curable resin composition
- Publication number 20040106766
- Publication date Jun 3, 2004
- THE YOKOHAMA RUBBER CO., LTD.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Compound having thermally dissociatable thioacetal skeleton, precur...
- Publication number 20040014935
- Publication date Jan 22, 2004
- Wonmun Choi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
One-part, room temperature moisture curable resin composition
- Publication number 20030139559
- Publication date Jul 24, 2003
- THE YOKOHAMA RUBBER CO., LTD.
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel latent curing agent and moisture-curable epoxy resin composition
- Publication number 20030100676
- Publication date May 29, 2003
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable resin composition
- Publication number 20030060561
- Publication date Mar 27, 2003
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable compounds, curable resin compositions containing the same a...
- Publication number 20020183449
- Publication date Dec 5, 2002
- Hiroyuki Okuhira
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Curable resin composition and novel latent curing agent
- Publication number 20020183461
- Publication date Dec 5, 2002
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ONE-PACK COMPOSITION OF EPOXY RESIN (S) WITH NO OH GROUPS AND KETIMINE
- Publication number 20020169259
- Publication date Nov 14, 2002
- HIROYUKI OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel latent curing agent and moisture-curable epoxy resin composition
- Publication number 20010041782
- Publication date Nov 15, 2001
- Hiroyuki Okuhira
- C07 - ORGANIC CHEMISTRY

Hiroyuki Okuhira

Person

Patents Grantslast 30 patents

Epoxy resin composition for fiber reinforced composite material

Curable resin composition

Curing component and curable resin composition containing the curin...

Compound having thermally dissociatable thioacetal skeleton, precur...

One-part, room temperature moisture curable resin composition

Composition of polyepoxide and oxazolidine latent curing agent

One-part, room temperature moisture curable resin composition

Curable compounds, curable resin compositions containing the same a...

Curable resin composition and novel latent curing agent

Adhesive of thiirane and oxirane-containing compound and oxirane-co...

One-pack cold moisture curable resin compositions

One-pack composition of epoxy resin(s) with no oh groups and ketimine

One-part moisture curable composition

One-pack type moisture-curable composition

Room temperature curing polyurethane compositions

Patents Applicationslast 30 patents

EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL

MODIFIED CONJUGATED DIENE-BASED POLYMER RUBBER AND RUBBER COMPOSITI...

Moisture-curable resin composition

Curable resin composition

Curable resin composition

One-part, room temperature moisture curable resin composition

Curable resin composition

Curing component and curable resin composition containing the curin...

One-part, room temperature moisture curable resin composition

Compound having thermally dissociatable thioacetal skeleton, precur...

One-part, room temperature moisture curable resin composition

Novel latent curing agent and moisture-curable epoxy resin composition

Curable resin composition

Curable compounds, curable resin compositions containing the same a...

Curable resin composition and novel latent curing agent

ONE-PACK COMPOSITION OF EPOXY RESIN (S) WITH NO OH GROUPS AND KETIMINE

Novel latent curing agent and moisture-curable epoxy resin composition