Hiroyuki Okuhira

Person

Kariya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable resin composition and electrical component using the same
- Patent number 11,795,325
- Issue date Oct 24, 2023
- Denso Corporation
- Akira Takakura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable polyurethane type resin composition and electrical device u...
- Patent number 10,717,867
- Issue date Jul 21, 2020
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 9,789,637
- Issue date Oct 17, 2017
- Denso Corporation
- Ryosuke Izumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin additive, polyphenylene sulfide resin composition, and electr...
- Patent number 9,290,638
- Issue date Mar 22, 2016
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hardening resin composition, sealing material, and electronic devic...
- Patent number 9,082,709
- Issue date Jul 14, 2015
- Denso Corporation
- Hiroyuki Okuhira
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURABLE COMPOSITION AND ELECTRONIC DEVICE
- Publication number 20210317251
- Publication date Oct 14, 2021
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME
- Publication number 20210002413
- Publication date Jan 7, 2021
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME
- Publication number 20200362166
- Publication date Nov 19, 2020
- DENSO CORPORATION
- Akira TAKAKURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION AND ELETRICAL COMPONENT USING THE SAME
- Publication number 20200291170
- Publication date Sep 17, 2020
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN-SEALED COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20190344483
- Publication date Nov 14, 2019
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CURABLE POLYURETHANE TYPE RESIN COMPOSITION AND ELECTRICAL DEVICE U...
- Publication number 20190144668
- Publication date May 16, 2019
- Denso Corporation
- Hiroyuki OKUHIRA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRICAL COMPONENT
- Publication number 20160001528
- Publication date Jan 7, 2016
- DENSO CORPORATION
- Akira TAKAKURA
- B32 - LAYERED PRODUCTS
Information Patent Application
CURABLE RESIN, SEALING MEMBER, AND ELECTRONIC DEVICE PRODUCT USING...
- Publication number 20150166728
- Publication date Jun 18, 2015
- DENSO CORPORATION
- Hiroyuki OKUHIRA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150158221
- Publication date Jun 11, 2015
- Denso Corporation
- Ryosuke Izumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVIC...
- Publication number 20140264959
- Publication date Sep 18, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTR...
- Publication number 20140262414
- Publication date Sep 18, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE
- Publication number 20140150973
- Publication date Jun 5, 2014
- DENSO CORPORATION
- Hiroyuki Okuhira
- B32 - LAYERED PRODUCTS
Information Patent Application
REACTOR FOR ELECTRICAL DEVICES
- Publication number 20100245016
- Publication date Sep 30, 2010
- DENSO CORPORATION
- Mitsutoshi Kameda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymerization-curable composition, method for polymerization curin...
- Publication number 20100099805
- Publication date Apr 22, 2010
- DENSO CORPORATION
- Hiroyuki Okuhira
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hiroyuki Okuhira

Person

Patents Grantslast 30 patents

Curable resin composition and electrical component using the same

Curable polyurethane type resin composition and electrical device u...

Electronic device and method for manufacturing the same

Resin additive, polyphenylene sulfide resin composition, and electr...

Hardening resin composition, sealing material, and electronic devic...

Patents Applicationslast 30 patents

CURABLE COMPOSITION AND ELECTRONIC DEVICE

CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME

CURABLE RESIN COMPOSITION AND ELECTRICAL COMPONENT USING THE SAME

CURABLE RESIN COMPOSITION AND ELETRICAL COMPONENT USING THE SAME

RESIN-SEALED COMPONENT AND METHOD FOR PRODUCING SAME

CURABLE POLYURETHANE TYPE RESIN COMPOSITION AND ELECTRICAL DEVICE U...

ELECTRICAL COMPONENT

CURABLE RESIN, SEALING MEMBER, AND ELECTRONIC DEVICE PRODUCT USING...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVIC...

RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTR...

EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE

REACTOR FOR ELECTRICAL DEVICES

Polymerization-curable composition, method for polymerization curin...