Hiroyuki Sagawa

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Moriyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat seal structure
- Patent number 5,759,668
- Issue date Jun 2, 1998
- Omron Corporation
- Tatsuro Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic relay
- Patent number 5,270,674
- Issue date Dec 14, 1993
- Omron Corporation
- Yoichi Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile electromagnetic relay to printed circuit board
- Patent number 4,831,348
- Issue date May 16, 1989
- Omron Tateisi Electronics Co.
- Shunichi Agatahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for surface mounted type component with projecti...
- Patent number 4,814,944
- Issue date Mar 21, 1989
- Omron Tateisi Electronics Co.
- Hiroyuki Sagawa
- H01 - BASIC ELECTRIC ELEMENTS