Hiroyuki Senzai

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reinforcing sheet and method for producing secondary mounted semico...
- Patent number 9,472,439
- Issue date Oct 18, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,368,421
- Issue date Jun 14, 2016
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated film and use thereof
- Patent number 9,202,795
- Issue date Dec 1, 2015
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,085,685
- Issue date Jul 21, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated sheet and method of manufacturing semiconductor device us...
- Patent number 8,951,843
- Issue date Feb 10, 2015
- Nitto Denko Corporation
- Hiroyuki Senzai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,420,510
- Issue date Apr 16, 2013
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...
- Publication number 20160042986
- Publication date Feb 11, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Under-Fill Material and Method for Producing Semiconductor Device
- Publication number 20150270188
- Publication date Sep 24, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Laminated Sheet and Method of Manufacturing Semiconductor Device Us...
- Publication number 20150104649
- Publication date Apr 16, 2015
- Nitto Denko Corporation
- Hiroyuki Senzai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED SHEET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE US...
- Publication number 20130149842
- Publication date Jun 13, 2013
- Nitto Denko Corporation
- Hiroyuki Senzai
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDER-FILL MATERIAL AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130137218
- Publication date May 30, 2013
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130137219
- Publication date May 30, 2013
- Nitto Denko Corporation
- Hiroyuki Senzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED FILM AND USE THEREOF
- Publication number 20120326280
- Publication date Dec 27, 2012
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120329250
- Publication date Dec 27, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME,...
- Publication number 20120205820
- Publication date Aug 16, 2012
- Nitto Denko Corporation
- Takashi Oda
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Senzai

Person

Patents Grantslast 30 patents

Reinforcing sheet and method for producing secondary mounted semico...

Under-fill material and method for producing semiconductor device

Laminated film and use thereof

Under-fill material and method for producing semiconductor device

Laminated sheet and method of manufacturing semiconductor device us...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...

Under-Fill Material and Method for Producing Semiconductor Device

Laminated Sheet and Method of Manufacturing Semiconductor Device Us...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATED SHEET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE US...

UNDER-FILL MATERIAL AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATED FILM AND USE THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME,...