Hiroyuki SHINOZAKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Buffer chamber and AM system including a buffer chamber
- Patent number 12,226,825
- Issue date Feb 18, 2025
- Ebara Corporation
- Hiroyuki Shinozaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Coupling mechanism with spherical bearing, method of determining be...
- Patent number 12,208,488
- Issue date Jan 28, 2025
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Measurement jig
- Patent number D1035468
- Issue date Jul 16, 2024
- Ebara Corporation
- Hiroyuki Shinozaki
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Measurement jig
- Patent number D1034248
- Issue date Jul 9, 2024
- Ebara Corporation
- Hiroyuki Shinozaki
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Polishing apparatus
- Patent number 11,583,973
- Issue date Feb 21, 2023
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus
- Patent number 11,472,002
- Issue date Oct 18, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate adsorption method, substrate holding apparatus, substrate...
- Patent number 11,472,000
- Issue date Oct 18, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Measurement jig
- Patent number D954567
- Issue date Jun 14, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Method of monitoring a dressing process and polishing apparatus
- Patent number 11,325,224
- Issue date May 10, 2022
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Film thickness measuring device and polishing device
- Patent number 11,065,734
- Issue date Jul 20, 2021
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 10,926,374
- Issue date Feb 23, 2021
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 10,870,183
- Issue date Dec 22, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Dressing device, polishing apparatus, holder, housing and dressing...
- Patent number 10,777,417
- Issue date Sep 15, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 10,688,620
- Issue date Jun 23, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of monitoring a dressing process and polishing apparatus
- Patent number 10,675,731
- Issue date Jun 9, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate cleaning apparatus, substrate processing apparatus, and s...
- Patent number 10,661,409
- Issue date May 26, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B08 - CLEANING
Information Patent Grant
Dressing device, polishing apparatus, holder, housing and dressing...
- Patent number 10,636,665
- Issue date Apr 28, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate polishing apparatus
- Patent number 10,625,395
- Issue date Apr 21, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus
- Patent number 10,576,604
- Issue date Mar 3, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate adsorption method, substrate holding apparatus, substrate...
- Patent number 10,537,975
- Issue date Jan 21, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 10,486,285
- Issue date Nov 26, 2019
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Coupling mechanism, substrate polishing apparatus, method of determ...
- Patent number 10,442,054
- Issue date Oct 15, 2019
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 10,170,345
- Issue date Jan 1, 2019
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Dresser disk cleaning brush, cleaning apparatus, and cleaning method
- Patent number 10,086,495
- Issue date Oct 2, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- B08 - CLEANING
Information Patent Grant
Substrate processing apparatus
- Patent number 10,032,656
- Issue date Jul 24, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus
- Patent number 10,029,343
- Issue date Jul 24, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and controlling the same
- Patent number 10,016,871
- Issue date Jul 10, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus, method for controlling the same, and method fo...
- Patent number 9,962,804
- Issue date May 8, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for monitoring a polishing surface of a polish...
- Patent number 9,943,943
- Issue date Apr 17, 2018
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DED NOZZLE FOR USE WITH AN AM APPARATUS AND ADAPTER DETACHABLY ATTA...
- Publication number 20240042529
- Publication date Feb 8, 2024
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BUFFER CHAMBER AND AM SYSTEM INCLUDING A BUFFER CHAMBER
- Publication number 20240001448
- Publication date Jan 4, 2024
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK
- Publication number 20230415299
- Publication date Dec 28, 2023
- EBARA CORPORATION
- HIROYUKI SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
POWDER SUPPLY APPARATUS AND AM APPARATUS USING A POWDER SUPPLY APPA...
- Publication number 20230398605
- Publication date Dec 14, 2023
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AM APPARATUS AND AM METHOD
- Publication number 20230219139
- Publication date Jul 13, 2023
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POLISHING APPARATUS
- Publication number 20230158632
- Publication date May 25, 2023
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE LEARNING APPARATUS, AM APPARATUS, MACHINE LEARNING METHOD,...
- Publication number 20220334553
- Publication date Oct 20, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- G05 - CONTROLLING REGULATING
Information Patent Application
AM APPARATUS
- Publication number 20220324027
- Publication date Oct 13, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AM APPARATUS
- Publication number 20220258248
- Publication date Aug 18, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AM APPARATUS
- Publication number 20220234285
- Publication date Jul 28, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AM APPARATUS AND METHOD FOR MANUFACTURING A FABRICATED OBJECT
- Publication number 20220226899
- Publication date Jul 21, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AM APPARATUS FOR MANUFACTURING A FABRICATED OBJECT AND METHOD FOR T...
- Publication number 20220212261
- Publication date Jul 7, 2022
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POLISHING APPARATUS
- Publication number 20200269381
- Publication date Aug 27, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS
- Publication number 20200254585
- Publication date Aug 13, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
DUMMY DISK, DRESSING DISK, AND SURFACE HEIGHT MEASUREMENT METHOD US...
- Publication number 20200246936
- Publication date Aug 6, 2020
- EBARA CORPORATION
- HIROYUKI SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...
- Publication number 20200219728
- Publication date Jul 9, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20200198093
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...
- Publication number 20200094372
- Publication date Mar 26, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20200047309
- Publication date Feb 13, 2020
- Mitsuru MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
COUPLING MECHANISM WITH SPHERICAL BEARING, METHOD OF DETERMINING BE...
- Publication number 20200039030
- Publication date Feb 6, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TREATMENT APPARATUS
- Publication number 20190126430
- Publication date May 2, 2019
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20180093360
- Publication date Apr 5, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20180093363
- Publication date Apr 5, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
COUPLING MECHANISM, SUBSTRATE POLISHING APPARATUS, METHOD OF DETERM...
- Publication number 20180071885
- Publication date Mar 15, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...
- Publication number 20180047572
- Publication date Feb 15, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS
- Publication number 20180021920
- Publication date Jan 25, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20180012780
- Publication date Jan 11, 2018
- EBARA CORPORATION
- Hiroyuki Shinozaki
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20170291274
- Publication date Oct 12, 2017
- EBARA CORPORATION
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20170284579
- Publication date Oct 5, 2017
- EBARA CORPORATION
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20170252894
- Publication date Sep 7, 2017
- EBARA CORPORATION
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki SHINOZAKI

Person

Patents Grantslast 30 patents

Buffer chamber and AM system including a buffer chamber

Coupling mechanism with spherical bearing, method of determining be...

Measurement jig

Measurement jig

Polishing apparatus

Substrate polishing apparatus

Substrate adsorption method, substrate holding apparatus, substrate...

Substrate processing apparatus, substrate processing method, substr...

Measurement jig

Method of monitoring a dressing process and polishing apparatus

Film thickness measuring device and polishing device

Substrate processing apparatus

Substrate processing apparatus

Dressing device, polishing apparatus, holder, housing and dressing...

Polishing apparatus

Method of monitoring a dressing process and polishing apparatus

Substrate cleaning apparatus, substrate processing apparatus, and s...

Dressing device, polishing apparatus, holder, housing and dressing...

Substrate polishing apparatus

Substrate polishing apparatus

Substrate adsorption method, substrate holding apparatus, substrate...

Substrate processing apparatus, substrate processing method, substr...

Coupling mechanism, substrate polishing apparatus, method of determ...

Substrate processing apparatus

Dresser disk cleaning brush, cleaning apparatus, and cleaning method

Substrate processing apparatus

Polishing apparatus

Polishing apparatus and controlling the same

Polishing apparatus, method for controlling the same, and method fo...

Method and apparatus for monitoring a polishing surface of a polish...

Patents Applicationslast 30 patents

DED NOZZLE FOR USE WITH AN AM APPARATUS AND ADAPTER DETACHABLY ATTA...

BUFFER CHAMBER AND AM SYSTEM INCLUDING A BUFFER CHAMBER

SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK

POWDER SUPPLY APPARATUS AND AM APPARATUS USING A POWDER SUPPLY APPA...

AM APPARATUS AND AM METHOD

POLISHING APPARATUS

MACHINE LEARNING APPARATUS, AM APPARATUS, MACHINE LEARNING METHOD,...

AM APPARATUS

AM APPARATUS

AM APPARATUS

AM APPARATUS AND METHOD FOR MANUFACTURING A FABRICATED OBJECT

AM APPARATUS FOR MANUFACTURING A FABRICATED OBJECT AND METHOD FOR T...

POLISHING APPARATUS

METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS

DUMMY DISK, DRESSING DISK, AND SURFACE HEIGHT MEASUREMENT METHOD US...

DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...

SUBSTRATE POLISHING APPARATUS

SUBSTRATE ADSORPTION METHOD, SUBSTRATE HOLDING APPARATUS, SUBSTRATE...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

COUPLING MECHANISM WITH SPHERICAL BEARING, METHOD OF DETERMINING BE...

SUBSTRATE TREATMENT APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE POLISHING APPARATUS

COUPLING MECHANISM, SUBSTRATE POLISHING APPARATUS, METHOD OF DETERM...

DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...

METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...