Hiroyuki SHOJI

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame and manufacturing method thereof, and semiconductor appa...
- Patent number 7,808,086
- Issue date Oct 5, 2010
- NEC Electronics Corporation
- Akimi Saiki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Resin-molded package with cavity structure
- Patent number 7,187,073
- Issue date Mar 6, 2007
- NEC Electronics Corporation
- Hiroyuki Shoji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPA...
- Publication number 20080296746
- Publication date Dec 4, 2008
- NEC Electronics Corporation
- Akimi SAIKI
- H01 - BASIC ELECTRIC ELEMENTS