Hiroyuki Sugawara

Person

Tsuchiura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Galvanoscanner and laser processing machine
- Patent number 9,030,060
- Issue date May 12, 2015
- Via Mechanics, Ltd.
- Akihiro Yamamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Galvanoscanner and laser processing machine
- Patent number 9,030,061
- Issue date May 12, 2015
- Via Mechanics, Ltd.
- Akihiro Yamamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Galvanoscanner and laser processing machine
- Patent number 8,780,429
- Issue date Jul 15, 2014
- Via Mechanics, Ltd.
- Akihiro Yamamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and apparatus for perforating printed circuit board
- Patent number 8,278,594
- Issue date Oct 2, 2012
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser perforating printed circuit board
- Patent number 7,531,767
- Issue date May 12, 2009
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining position of reference point
- Patent number 7,522,262
- Issue date Apr 21, 2009
- Hitachi Via Mechanics Ltd.
- Hiroyuki Sugawara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining apparatus
- Patent number 7,521,650
- Issue date Apr 21, 2009
- Hitachi Via Mechanics, Ltd.
- Sadao Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Galvanoscanner and Laser Processing Machine
- Publication number 20140285036
- Publication date Sep 25, 2014
- Akihiro YAMAMOTO
- G02 - OPTICS
Information Patent Application
Galvanoscanner and Laser Processing Machine
- Publication number 20140285037
- Publication date Sep 25, 2014
- Akihiro YAMAMOTO
- G02 - OPTICS
Information Patent Application
Galvanoscanner and Laser Processing Machine
- Publication number 20120105930
- Publication date May 3, 2012
- HITACHI VIA MECHANICS, LTD.
- Akihiro Yamamoto
- G02 - OPTICS
Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20090166340
- Publication date Jul 2, 2009
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20060211158
- Publication date Sep 21, 2006
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for determining position of reference point
- Publication number 20050270518
- Publication date Dec 8, 2005
- Hitachi Via Mechanics Ltd.
- Hiroyuki Sugawara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining apparatus
- Publication number 20050127051
- Publication date Jun 16, 2005
- Hitachi Via Mechanics Ltd.
- Sadao Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20040188401
- Publication date Sep 30, 2004
- Sadao Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hiroyuki Sugawara

Person

Patents Grantslast 30 patents

Galvanoscanner and laser processing machine

Galvanoscanner and laser processing machine

Galvanoscanner and laser processing machine

Method and apparatus for perforating printed circuit board

Method and apparatus for laser perforating printed circuit board

Method for determining position of reference point

Laser machining apparatus

Patents Applicationslast 30 patents

Galvanoscanner and Laser Processing Machine

Galvanoscanner and Laser Processing Machine

Galvanoscanner and Laser Processing Machine

Method and apparatus for perforating printed circuit board

Method and apparatus for perforating printed circuit board

Method for determining position of reference point

Laser machining apparatus

LASER PROCESSING APPARATUS