Hiroyuki Takenaka

Person

Usui-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 7,692,318
- Issue date Apr 6, 2010
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Takenaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 7,122,587
- Issue date Oct 17, 2006
- Shin-Etsu Chemical Co., Ltd.
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 6,783,859
- Issue date Aug 31, 2004
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Epoxy Resin Composition and Die Bonding Material Comprising the Com...
- Publication number 20090133833
- Publication date May 28, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing flip-chip type semiconductor device and semic...
- Publication number 20070134844
- Publication date Jun 14, 2007
- Shin-Etsu Chemical Co., Ltd.
- Kaoru Katoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition and semiconductor device
- Publication number 20060217499
- Publication date Sep 28, 2006
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Takenaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid epoxy resin composition and semiconductor device
- Publication number 20050152773
- Publication date Jul 14, 2005
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20040072968
- Publication date Apr 15, 2004
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20030152777
- Publication date Aug 14, 2003
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hiroyuki Takenaka

Person

Patents Grantslast 30 patents

Liquid epoxy resin composition and semiconductor device

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating flame retardant epoxy resin composition...

Patents Applicationslast 30 patents

Epoxy Resin Composition and Die Bonding Material Comprising the Com...

Process for producing flip-chip type semiconductor device and semic...

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating flame retardant epoxy resin composition...