Hiroyuki Tanahashi

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of connecting TAB tape to semiconductor chip, and bump sheet...
- Patent number 5,164,336
- Issue date Nov 17, 1992
- Nippon Steel Corporation
- Yasuhide Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding bumps to leads of tab tape and an apparatus for a...
- Patent number 5,114,878
- Issue date May 19, 1992
- Nippon Steel Corporation
- Tadakatsu Maruyama
- H01 - BASIC ELECTRIC ELEMENTS