Hiroyuki TANAKA

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Tokushima-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin package and light emitting device
- Patent number 11,257,994
- Issue date Feb 22, 2022
- Nichia Corporation
- Kazuya Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting devices
- Patent number 11,251,334
- Issue date Feb 15, 2022
- Nichia Corporation
- Hiroyuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting device
- Patent number 11,183,619
- Issue date Nov 23, 2021
- Nichia Corporation
- Hiroyuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for light emitting device, and light emitting device
- Patent number 9,048,390
- Issue date Jun 2, 2015
- Nichia Corporation
- Takayoshi Wakaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICES
- Publication number 20200243710
- Publication date Jul 30, 2020
- Nichia Corporation.
- Hiroyuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PACKAGE AND LIGHT EMITTING DEVICE
- Publication number 20200212274
- Publication date Jul 2, 2020
- Nichia Corporation.
- Kazuya MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
- Publication number 20200176649
- Publication date Jun 4, 2020
- Nichia Corporation.
- Hiroyuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE
- Publication number 20140312364
- Publication date Oct 23, 2014
- Nichia Corporation.
- Takayoshi WAKAKI
- H01 - BASIC ELECTRIC ELEMENTS