Membership
Tour
Register
Log in
Hiroyuki Tsukui
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of forming solder bumps on a semiconductor device using bump...
Patent number
6,432,807
Issue date
Aug 13, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020177295
Publication date
Nov 28, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020173135
Publication date
Nov 21, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020173136
Publication date
Nov 21, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS