Hiroyuki Yasuda

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Area mount type semiconductor device, and die bonding resin composi...
- Patent number 7,560,821
- Issue date Jul 14, 2009
- Sumitomo Bakelite Company, Ltd.
- Hironori Osuga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, resin composition for buffer coating, resin c...
- Publication number 20060228562
- Publication date Oct 12, 2006
- Ken Ukawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Area mount type semiconductor device, and die bonding resin composi...
- Publication number 20060226525
- Publication date Oct 12, 2006
- Hironori Osuga
- H01 - BASIC ELECTRIC ELEMENTS