Hiroyuki Yasuda

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Vehicle body rear part structure
- Patent number 11,634,180
- Issue date Apr 25, 2023
- Honda Motor Co., Ltd.
- Masahiro Kawazu
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Organometallic complex catalyst
- Patent number 11,167,278
- Issue date Nov 9, 2021
- Advanced Industrial Science and Technology
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Organometallic complex catalyst
- Patent number 11,161,103
- Issue date Nov 2, 2021
- National Institute of Advanced Industrial Science and Technology
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for producing thin wafer
- Patent number 11,069,557
- Issue date Jul 20, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesive film roll for substrate processing, method for m...
- Patent number 10,796,939
- Issue date Oct 6, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of carbamic acid ester
- Patent number 10,752,579
- Issue date Aug 25, 2020
- National Institute of Advanced Industrial Science and Technology
- Jun-Chul Choi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin composition containing supported platinum catalyst, thermoset...
- Patent number 10,738,190
- Issue date Aug 11, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masayuki Ikeno
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device, method for producing the same, and laminate
- Patent number 10,727,103
- Issue date Jul 28, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate, method for production thereof, and adhesive composi...
- Patent number 10,658,314
- Issue date May 19, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer laminate and method of producing the same
- Patent number 10,553,552
- Issue date Feb 4, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate and making method
- Patent number 10,453,732
- Issue date Oct 22, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate and making method
- Patent number 10,373,903
- Issue date Aug 6, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, making method, and laminate
- Patent number 10,297,485
- Issue date May 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,242,902
- Issue date Mar 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal complex and supported metal complex having disiloxane as liga...
- Patent number 10,213,777
- Issue date Feb 26, 2019
- National Institute of Advanced Industrial Science and Technology
- Jun-Chul Choi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,147,632
- Issue date Dec 4, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,128,143
- Issue date Nov 13, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate and making method
- Patent number 10,074,626
- Issue date Sep 11, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing catalyst for cyclic carbonate synthesis
- Patent number 10,029,241
- Issue date Jul 24, 2018
- Maruzen Petrochemical Co., Ltd.
- Takashi Naniki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for producing silica gel-immobolized phosphonium salt catalysts
- Patent number 10,011,621
- Issue date Jul 3, 2018
- Maruzen Petrochemical Co., Ltd.
- Masuo Yamazaki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for producing tetraalkoxysilane
- Patent number 10,000,514
- Issue date Jun 19, 2018
- National Institute of Advanced Industrial Science and Technology
- Norihisa Fukaya
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Wafer processing temporary bonding arrangement, wafer processing la...
- Patent number 9,941,145
- Issue date Apr 10, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing bonding arrangement, wafer laminate, and thin wafe...
- Patent number 9,934,996
- Issue date Apr 3, 2018
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesion method and method for producing thin wafer
- Patent number 9,884,979
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing cyclic carbonate
- Patent number 9,856,229
- Issue date Jan 2, 2018
- National Institute of Advanced Industrial Science and Technology
- Toshikazu Takahashi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for producing catalyst for cyclic carbonate synthesis
- Patent number 9,834,536
- Issue date Dec 5, 2017
- National Institute of Advanced Industrial Science and Technology
- Toshikazu Takahashi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Silicone adhesive composition and solid-state imaging device
- Patent number 9,796,892
- Issue date Oct 24, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer temporary bonding method and thin wafer manufacturing method
- Patent number 9,646,868
- Issue date May 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Metal complex and supported metal complex having disiloxane as liga...
- Patent number 9,616,418
- Issue date Apr 11, 2017
- National Institute of Advanced Industrial Science and Technology
- Jun-Chul Choi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for continuously producing cyclic carbonate
- Patent number 9,586,927
- Issue date Mar 7, 2017
- Maruzen Petrochemical Co., Ltd.
- Takashi Naniki
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE AND AD...
- Publication number 20240182767
- Publication date Jun 6, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION, AND ADHESIVE AND A...
- Publication number 20230045921
- Publication date Feb 16, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE CONTAI...
- Publication number 20230015835
- Publication date Jan 19, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOCURABLE FLUOROPOLYETHER-BASED ELASTOMER COMPOSITION AND BONDIN...
- Publication number 20220396662
- Publication date Dec 15, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...
- Publication number 20220372353
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
VEHICLE BODY REAR PART STRUCTURE
- Publication number 20220111907
- Publication date Apr 14, 2022
- Honda Motor Co., Ltd.
- Masahiro KAWAZU
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
ORGANOMETALLIC COMPLEX CATALYST
- Publication number 20220032278
- Publication date Feb 3, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ORGANOMETALLIC COMPLEX CATALYST
- Publication number 20220008905
- Publication date Jan 13, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ORGANOMETALLIC COMPLEX CATALYST
- Publication number 20200188897
- Publication date Jun 18, 2020
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR PRODUCING THIN WAFER
- Publication number 20200075388
- Publication date Mar 5, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANOMETALLIC COMPLEX CATALYST
- Publication number 20190308182
- Publication date Oct 10, 2019
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Junchul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PRODUCTION METHOD OF CARBAMIC ACID ESTER
- Publication number 20190185420
- Publication date Jun 20, 2019
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Jun-Chul CHOI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
RESIN COMPOSITION CONTAINING SUPPORTED PLATINUM CATALYST, THERMOSET...
- Publication number 20190100649
- Publication date Apr 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IKENO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND LAMINATE
- Publication number 20190103299
- Publication date Apr 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...
- Publication number 20180350650
- Publication date Dec 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE
- Publication number 20180277415
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE AND MAKING METHOD
- Publication number 20180277472
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...
- Publication number 20180102333
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATE AND METHOD OF PRODUCING THE SAME
- Publication number 20180102334
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170352637
- Publication date Dec 7, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Producing Tetraalkoxysilane
- Publication number 20170267701
- Publication date Sep 21, 2017
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Norihisa Fukaya
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METAL COMPLEX AND SUPPORTED METAL COMPLEX HAVING DISILOXANE AS LIGA...
- Publication number 20170225156
- Publication date Aug 10, 2017
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Jun-Chul Choi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170154802
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170110360
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER
- Publication number 20170101555
- Publication date Apr 13, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170069521
- Publication date Mar 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...
- Publication number 20170053821
- Publication date Feb 23, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LA...
- Publication number 20170004989
- Publication date Jan 5, 2017
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE
- Publication number 20160289519
- Publication date Oct 6, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160189996
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS

Hiroyuki Yasuda

Person

Patents Grantslast 30 patents

Vehicle body rear part structure

Organometallic complex catalyst

Organometallic complex catalyst

Method for producing thin wafer

Temporary adhesive film roll for substrate processing, method for m...

Production method of carbamic acid ester

Resin composition containing supported platinum catalyst, thermoset...

Semiconductor device, method for producing the same, and laminate

Wafer laminate, method for production thereof, and adhesive composi...

Wafer laminate and method of producing the same

Wafer laminate and making method

Laminate and making method

Semiconductor device, making method, and laminate

Wafer processing laminate, temporary adhesive material for wafer pr...

Metal complex and supported metal complex having disiloxane as liga...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer laminate and making method

Method for producing catalyst for cyclic carbonate synthesis

Method for producing silica gel-immobolized phosphonium salt catalysts

Method for producing tetraalkoxysilane

Wafer processing temporary bonding arrangement, wafer processing la...

Wafer processing bonding arrangement, wafer laminate, and thin wafe...

Temporary adhesion method and method for producing thin wafer

Method for producing cyclic carbonate

Method for producing catalyst for cyclic carbonate synthesis

Silicone adhesive composition and solid-state imaging device

Wafer temporary bonding method and thin wafer manufacturing method

Metal complex and supported metal complex having disiloxane as liga...

Method for continuously producing cyclic carbonate

Patents Applicationslast 30 patents

CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE AND AD...

CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION, AND ADHESIVE AND A...

CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE CONTAI...

PHOTOCURABLE FLUOROPOLYETHER-BASED ELASTOMER COMPOSITION AND BONDIN...

TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...

VEHICLE BODY REAR PART STRUCTURE

ORGANOMETALLIC COMPLEX CATALYST

ORGANOMETALLIC COMPLEX CATALYST

ORGANOMETALLIC COMPLEX CATALYST

METHOD FOR PRODUCING THIN WAFER

ORGANOMETALLIC COMPLEX CATALYST

PRODUCTION METHOD OF CARBAMIC ACID ESTER

RESIN COMPOSITION CONTAINING SUPPORTED PLATINUM CATALYST, THERMOSET...

SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND LAMINATE

TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...

SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE

LAMINATE AND MAKING METHOD

WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...

WAFER LAMINATE AND METHOD OF PRODUCING THE SAME

WAFER LAMINATE AND MAKING METHOD

Method for Producing Tetraalkoxysilane

METAL COMPLEX AND SUPPORTED METAL COMPLEX HAVING DISILOXANE AS LIGA...

WAFER LAMINATE AND MAKING METHOD

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...

WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LA...

SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...