Hiroyuki Yasutomi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer surface observation apparatus
- Patent number 7,565,002
- Issue date Jul 21, 2009
- Tokyo Seimitsu Co., Ltd.
- Hiroyuki Yasutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing apparatus, kerf inspecting method and kerf inspecting system
- Patent number 6,422,227
- Issue date Jul 23, 2002
- Tokyo Seimitsu Co., Ltd.
- Ryoko Kobayashi
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Dicing apparatus and dicing method
- Publication number 20070087661
- Publication date Apr 19, 2007
- TOKYO SEIMITSU CO., LTD.
- Masanobu KOYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer observation position designating apparatus and wafer display...
- Publication number 20050105790
- Publication date May 19, 2005
- Hiroyuki Yasutomi
- H01 - BASIC ELECTRIC ELEMENTS