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Hisahiko Yoshida

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Mounted structure and manufacturing method of mounted structure
    • Patent number 9,603,295
    • Issue date Mar 21, 2017
    • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    • Atsushi Yamaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and manufacturing method
    • Patent number 7,993,984
    • Issue date Aug 9, 2011
    • Panasonic Corporation
    • Yasuo Yokota
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device mounting structure, manufacturing method, and...
    • Patent number 7,969,028
    • Issue date Jun 28, 2011
    • Panasonic Corporation
    • Hisahiko Yoshida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder and soldered article
    • Patent number 7,282,174
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 6,926,849
    • Issue date Aug 9, 2005
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 6,736,907
    • Issue date May 18, 2004
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free zinc-containing solder paste
    • Patent number 6,440,228
    • Issue date Aug 27, 2002
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder powder and method for preparing the same and solder paste
    • Patent number 6,416,590
    • Issue date Jul 9, 2002
    • Matsushita Electric Industrial Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
    • Publication number 20140049930
    • Publication date Feb 20, 2014
    • PANASONIC CORPORATION
    • Atsushi Yamaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD
    • Publication number 20090014873
    • Publication date Jan 15, 2009
    • Yasuo Yokota
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, MANUFACTURING METHOD, AND...
    • Publication number 20080308930
    • Publication date Dec 18, 2008
    • Hisahiko Yoshida
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Lead-free solder and soldered article
    • Publication number 20060102690
    • Publication date May 18, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder pastes
    • Publication number 20040069974
    • Publication date Apr 15, 2004
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder paste
    • Publication number 20030121564
    • Publication date Jul 3, 2003
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free Zinc-Containing Solder Paste
    • Publication number 20020050305
    • Publication date May 2, 2002
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR