Hisahiko YOSHIDA

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
PREFORM SOLDER AND BONDING METHOD USING SAME
- Publication number 20230112020
- Publication date Apr 13, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Haruya SAKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic-field melting solder, and joining method in which same is...
- Publication number 20220402057
- Publication date Dec 22, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Haruya SAKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR