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Hisakazu Miyajima
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Osaka-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Capacitive sensor
Patent number
8,176,782
Issue date
May 15, 2012
Panasonic Electric Works Co., Ltd.
Eiichi Furukubo
G01 - MEASURING TESTING
Information
Patent Grant
Wafer level package structure and production method therefor
Patent number
8,080,869
Issue date
Dec 20, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Wafer level package structure, and sensor device obtained from the...
Patent number
8,067,769
Issue date
Nov 29, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor device and production method therefor
Patent number
8,026,594
Issue date
Sep 27, 2011
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor device and production method therefor
Patent number
7,674,638
Issue date
Mar 9, 2010
Panasonic Electric Works Co., Ltd.
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Capacitive sensor
Patent number
7,554,340
Issue date
Jun 30, 2009
Panasonic Electric Works Co., Ltd.
Eiichi Furukubo
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor acceleration sensor and method of manufacturing the same
Patent number
7,107,847
Issue date
Sep 19, 2006
Matsushita Electric Works, Ltd.
Hitoshi Yoshida
G01 - MEASURING TESTING
Information
Patent Grant
Mechanical deformation amount sensor
Patent number
6,848,320
Issue date
Feb 1, 2005
Matsushita Electric Works, Ltd.
Hisakazu Miyajima
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor relay circuit using photovoltaic diodes
Patent number
5,151,602
Issue date
Sep 29, 1992
Matsushita Electric Works, Ltd.
Yukio Idaka
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
CAPACITIVE SENSOR
Publication number
20090266164
Publication date
Oct 29, 2009
Panasonic Electric Works Co., Ltd.
Eiichi Furukubo
G01 - MEASURING TESTING
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE...
Publication number
20090267165
Publication date
Oct 29, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20090236678
Publication date
Sep 24, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND PRODUCTION METHOD THEREFOR
Publication number
20090159997
Publication date
Jun 25, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20090152656
Publication date
Jun 18, 2009
Takafumi Okudo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CAPACITIVE SENSOR
Publication number
20070273393
Publication date
Nov 29, 2007
MATSUSHITA ELECTRIC WORKS, Ltd.
Eiichi Furukubo
G01 - MEASURING TESTING
Information
Patent Application
Semiconductor acceleration sensor and method of manufacturing the same
Publication number
20040261529
Publication date
Dec 30, 2004
MATSUSHITA ELECTRIC WORKS, Ltd.
Hitoshi Yoshida
G01 - MEASURING TESTING
Information
Patent Application
Mechanical deformation amount sensor
Publication number
20040012062
Publication date
Jan 22, 2004
MATSUSHITA ELECTRIC WORKS, Ltd.
Hisakazu Miyajima
B81 - MICRO-STRUCTURAL TECHNOLOGY