Hisakazu Takano

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece and workpiece holder
- Patent number 10,350,788
- Issue date Jul 16, 2019
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of resuming operation of wire saw
- Patent number 9,662,805
- Issue date May 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for evaluating semiconductor wafer, apparatus for evaluating...
- Patent number 7,810,383
- Issue date Oct 12, 2010
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of cutting a workpiece with a wire saw
- Patent number 5,931,147
- Issue date Aug 3, 1999
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method of lapping works
- Patent number 5,800,251
- Issue date Sep 1, 1998
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER
- Publication number 20160303765
- Publication date Oct 20, 2016
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD OF RESUMING OPERATION OF WIRE SAW
- Publication number 20150328800
- Publication date Nov 19, 2015
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Evaluating Semiconductor Wafer, Apparatus for Evaluating...
- Publication number 20080166823
- Publication date Jul 10, 2008
- Keiichi Okabe
- G01 - MEASURING TESTING