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Hisakichi Onodera
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Hitachi, JP
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last 30 patents
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Patent Grant
Method of fabricating semiconductor device by bonding together sili...
Patent number
4,246,693
Issue date
Jan 27, 1981
Hitachi, Ltd.
Jin Onuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder layer for a semi-conductor device consisting of at least one...
Patent number
4,110,783
Issue date
Aug 29, 1978
Hitachi, Ltd.
Hisakichi Onodera
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR