Hisako Aoyama

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for fabricating a metal wiring and metal contact in a semic...
- Patent number 6,794,286
- Issue date Sep 21, 2004
- Kabushiki Kaisha Toshiba
- Hisako Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device
- Patent number 6,090,699
- Issue date Jul 18, 2000
- Kabushiki Kaisha Toshiba
- Hisako Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wiring layer with a barrier layer
- Patent number 5,592,024
- Issue date Jan 7, 1997
- Kabushiki Kaisha Toshiba
- Hisako Aoyama
- H01 - BASIC ELECTRIC ELEMENTS