Hisanao Yamamoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition and semiconductor sealing medium
- Patent number 7,932,319
- Issue date Apr 26, 2011
- ASAHI KASEI CHEMICALS CORPORATION
- Hisanao Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hardener for epoxy resin and epoxy resin composition
- Patent number 7,820,772
- Issue date Oct 26, 2010
- ASAHI KASEI CHEMICALS CORPORATION
- Taketoshi Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Thermosetting Resin Composition and Semiconductor Sealing Medium
- Publication number 20090258992
- Publication date Oct 15, 2009
- Hisanao Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Latent Hardener For Epoxy Resin and Epoxy Resin Composition
- Publication number 20080251757
- Publication date Oct 16, 2008
- Hisanao Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Hardener for Epoxy Resin and Epoxy Resin Composition
- Publication number 20070244268
- Publication date Oct 18, 2007
- ASAHI KASEI CHEMICALS CORPORATION
- Taketoshi Usui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...