TREA

Hisanori Takiguchi

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  • Saitama-City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Copper plating bath formulation
    • Patent number 7,857,961
    • Issue date Dec 28, 2010
    • Rohm and Haas Electronic Materials LLC
    • Shinjiro Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Copper plating process
    • Patent number 7,857,960
    • Issue date Dec 28, 2010
    • Rohm and Haas Electronic Materials LLC
    • Shinjiro Hayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Copper plating process
    • Publication number 20090038949
    • Publication date Feb 12, 2009
    • Rohm and Haas Electronic Materials L.L.C.
    • Shinjiro Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper plating bath formulation
    • Publication number 20090038951
    • Publication date Feb 12, 2009
    • Rohm and Haas Electronic Materials L.L.C.
    • Shinjiro Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR