Hisao Ishikawa

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Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing solder product, solder, soldered component...
- Patent number 11,802,322
- Issue date Oct 31, 2023
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method and production apparatus of tin or solder alloy f...
- Patent number 8,138,576
- Issue date Mar 20, 2012
- Nippon Joint Co., Ltd.
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering equipment and soldering method for electronic components
- Patent number 8,011,562
- Issue date Sep 6, 2011
- Nippon Joint Co., Ltd.
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT
- Publication number 20240002979
- Publication date Jan 4, 2024
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT...
- Publication number 20220025484
- Publication date Jan 27, 2022
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production Method and Production Apparatus of Tin or Solder Alloy f...
- Publication number 20110089567
- Publication date Apr 21, 2011
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Equipment and Soldering Method for Electronic Components
- Publication number 20110079633
- Publication date Apr 7, 2011
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR