Hisao Masuda

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Hyogo, JP

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Patents Grantslast 30 patents

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Semiconductor device with improved immunity to contact and conducto...
- Patent number 5,481,137
- Issue date Jan 2, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved immunity to contact and conducto...
- Patent number 5,260,604
- Issue date Nov 9, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,087,590
- Issue date Feb 11, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for assembling semiconductor devices
- Patent number 4,982,728
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hisao Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonding pad
- Patent number 4,916,397
- Issue date Apr 10, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Hisao Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 4,877,173
- Issue date Oct 31, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR