Hisao Tanaka

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ball capturing apparatus, solder ball disposing apparatus, ball cap...
- Patent number 7,717,317
- Issue date May 18, 2010
- Fujitsu Limited
- Masanao Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,744,183
- Issue date Jun 1, 2004
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,541,898
- Issue date Apr 1, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of assembling micro-actuator
- Patent number 6,467,141
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toru Okada
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...
- Publication number 20100326726
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Hisao Tanaka
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20080298218
- Publication date Dec 4, 2008
- FUJITSU LIMITED
- Hisao TANAKA
- G11 - INFORMATION STORAGE
Information Patent Application
BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...
- Publication number 20080020561
- Publication date Jan 24, 2008
- Fujitsu Limited
- Masanao FUJII
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method and apparatus
- Publication number 20060169750
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Hisao Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20030137223
- Publication date Jul 24, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20020074902
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling micro-actuator
- Publication number 20020059717
- Publication date May 23, 2002
- FUJITSU LIMITED
- Toru Okada
- H01 - BASIC ELECTRIC ELEMENTS

Hisao Tanaka

Person

Patents Grantslast 30 patents

Ball capturing apparatus, solder ball disposing apparatus, ball cap...

Method of bonding piezoelectric element and electrode, and piezoele...

Method of bonding piezoelectric element and electrode, and piezoele...

Method of assembling micro-actuator

Patents Applicationslast 30 patents

SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...

Soldering method and apparatus

Method of bonding piezoelectric element and electrode, and piezoele...

Method of bonding piezoelectric element and electrode, and piezoele...

Method of assembling micro-actuator